Technology

Vacuum Packaging

Category Technology Info Image
Special Packaging Wafer Chip Level Packaging
  • Si Wafer Structure
  • Vacuum Reflow
Technology
Hermetic Packaging
  • 10-3 torr
  • Solder Welding
  • Vacuum Reflow
Mass production
Vacuum Packaging Technology
TOF Packaging
  • 2W Laser Module
  • Heat Emission
Technology
Infrared Packaging
(Micro Bolometer)
  • Metal-Ceramic
  • Baffle Design
  • Cold Shield Design
  • IR Window
Technology
CNT X-ray Tube
(X-ray Source)
  • 10-8 torr
  • Ceramic Tube
Mass production
Optical Design
  • Infrared Lens
  • Visible Lens